In the world of electronics, miniaturization is key. Consumers demand smaller and more compact devices that offer the same level of functionality and performance as their larger counterparts. Achieving this goal requires innovative solutions, one of which is embedded passives.

Embedded passives are components that are integrated into a printed circuit board (PCB) during the manufacturing process. These components include resistors, capacitors, and inductors, and are designed to perform the same functions as their discrete counterparts, but in a much smaller space.

The use of embedded passives in PCB design has several advantages, the most significant of which is miniaturization. By embedding passive components directly into the board, it is possible to reduce the overall size of the device while maintaining the same level of functionality. This is particularly important in applications where space is at a premium, such as mobile phones, wearables, and IoT devices.

Another advantage of embedded passives is improved reliability. Discrete passive components are prone to failures due to mechanical stress, temperature changes, and other environmental factors. By embedding these components directly into the PCB, the risk of failure is greatly reduced. This is because the embedded components are protected from external factors that can cause damage, such as vibration and shock.

Embedded passives also offer improved performance compared to their discrete counterparts. This is because the components are located closer to the source of the signal, reducing the parasitic effects that can occur with discrete components. This leads to a reduction in signal loss and improved overall performance.

The use of embedded passives is not without its challenges, however. One of the main challenges is the design process. The integration of components into the PCB requires careful consideration of the board layout and the placement of components. This requires a high level of expertise in PCB design and an understanding of the properties of the passive components being used.

Another challenge is the manufacturing process. The embedding of components requires specialized equipment and processes, which can increase the cost of manufacturing. Additionally, the testing of embedded passives can be more challenging than discrete components, requiring specialized equipment and techniques.

Despite these challenges, the benefits of embedded passives for miniaturization make them an attractive option for many electronics applications. As technology continues to advance, the demand for smaller and more compact devices will only continue to grow. Embedded passives offer a solution that allows for the miniaturization of devices without sacrificing performance or reliability.

In conclusion, embedded passives offer a solution for miniaturization in electronics design. They offer several advantages over their discrete counterparts, including improved reliability, performance, and miniaturization. While there are challenges to their implementation, the benefits make them an attractive option for many electronics applications. As the demand for smaller and more compact devices continues to grow, embedded passives will play an increasingly important role in electronics design.

For further information on PCB layout and fabrication for your embedded passive miniaturization concept and design, please don’t hesitate to contact the team at sales@pcbglobal.com

In the world of high-frequency electronics, signal integrity is crucial. A PCB design with poor signal integrity can result in significant signal loss, cross-talk, and other issues that can degrade the overall performance of the system. High-frequency PCB materials offer a solution to this problem, as they are designed to improve signal integrity and reduce signal loss.

High-frequency PCB materials are engineered to have specific electrical properties that make them suitable for use in high-frequency applications. These materials are characterized by their low loss tangent, low dielectric constant, and high thermal stability. By using these materials, it is possible to achieve better signal integrity, reduce cross-talk, and improve overall system performance.

One of the most commonly used high-frequency PCB materials is Rogers Corporation's RO4000 series. This material is a high-performance thermoset laminate that offers excellent electrical properties, including a low dielectric constant and low loss tangent. These properties make it ideal for use in high-frequency applications, such as RF and microwave circuits.

Another commonly used high-frequency PCB material is DuPont's Pyralux® AP. This material is a flexible circuit material that offers excellent electrical performance, including a low dielectric constant and low loss tangent. Its flexibility makes it ideal for use in applications where space is at a premium, such as wearable devices and IoT sensors.

High-frequency PCB materials also offer improved thermal stability compared to traditional FR4 materials. This is because they are designed to withstand high temperatures without experiencing significant changes in their electrical properties. This makes them suitable for use in applications that require high power and generate significant heat, such as power amplifiers and high-frequency oscillators.

While high-frequency PCB materials offer many benefits, their use does come with some challenges. One of the main challenges is the increased cost of these materials compared to traditional FR4 materials. This is because the manufacturing process for these materials is more complex, requiring specialized equipment and processes.

Another challenge is the increased difficulty of working with these materials. High-frequency PCB materials are often more brittle and fragile than traditional FR4 materials, making them more challenging to handle and process. This requires specialized tools and techniques, which can increase the cost and complexity of the manufacturing process.

Despite these challenges, the benefits of high-frequency PCB materials for improved signal integrity make them an attractive option for many high-frequency electronics applications. By using these materials, it is possible to achieve better signal integrity, reduce signal loss, and improve overall system performance.

In conclusion, high-frequency PCB materials offer a solution to the problem of poor signal integrity in high-frequency electronics applications. These materials are engineered to have specific electrical properties that make them suitable for use in high-frequency circuits, such as RF and microwave circuits. While there are challenges to their use, including increased cost and difficulty in handling and processing, the benefits of improved signal integrity make them an attractive option for many applications. As the demand for high-frequency electronics continues to grow, the use of high-frequency PCB materials will become increasingly important in achieving better system performance.

For further information on the various material data on the design and fabrication for your high-frequency, signal integrity project, please don’t hesitate to contact the team at sales@pcbglobal.com

The relationship between the Internet of Things (IoT) and PCB (printed circuit board) fabrication is a close one, as PCBs are a crucial component in the design and manufacturing of IoT devices. IoT devices are connected to the internet and are able to collect and transmit data, and PCBs are the backbone that holds these devices together and allows them to function.

One of the key advantages of PCBs in IoT devices is their compact size and lightweight. IoT devices are designed to be small and portable, and PCBs can be made to match these specifications. This allows for the integration of more components into a smaller space, making the device more compact and portable. Additionally, flexible and stretchable PCBs can be used in IoT devices which need to be conformable to human body or move with it.

Another advantage of PCBs in IoT devices is their ability to withstand movement and vibration. IoT devices are often used in harsh environments, and traditional PCBs can be damaged by movement and vibration. PCBs can be designed to withstand movement and vibration, making them more durable and reliable for use in these types of devices.

The manufacturing process of PCBs for IoT devices is also different from traditional PCBs. IoT devices require PCBs with high-density interconnects and miniaturized components, and advanced manufacturing techniques such as microvia and laser drilling are used to achieve these specifications. Additionally, for IoT devices which require flexibility and stretchability in PCB, special materials such as polyimide or polyester are used as substrate instead of traditional FR4 materials.

However, there are also challenges associated with the use of PCBs in IoT devices. One of the main challenges is the cost. The materials and manufacturing process for PCBs for IoT devices are more expensive than traditional PCBs, which can make them more expensive to produce. Additionally, the testing and inspection of these PCBs are also more difficult, as they are more sensitive to handling and environmental conditions.

Despite these challenges, the use of PCBs in IoT devices is expected to continue growing in the coming years. The increasing demand for IoT devices is driving the development of new technologies and applications for PCBs. Additionally, advancements in materials and manufacturing techniques are expected to reduce the cost and improve the performance of PCBs for IoT devices.

In conclusion, the relationship between IoT and PCB fabrication is a close one, as PCBs are a crucial component in the design and manufacturing of IoT devices. PCBs offer several advantages for IoT devices, such as compact size, lightweight, and durability. However, there are also challenges associated with the use of PCBs in IoT devices, such as cost and complexity of manufacturing. Despite these challenges, the use of PCBs in IoT devices is expected to continue growing in the coming years as the demand for IoT devices increases.

For more information on design and fabrication of your next high-performance PCB, please don’t hesitate to contact the team at sales@pcbglobal.com

Arlon 85N Material
Arlon 85N is a pure polyimide laminate and prepreg system, offering the ultimate high-reliability solution, with significantly less PTH failure, delamination, or board degradation compared with FR-4, high-performance epoxies, or other high-performance materials.
ARLON 85N is a flame-retardant thermoset composite, Arlon 85N is a true rigid Polyimide material specifically designed for high-frequency and high-temperature applications. Arlon 85N offers several advantages over traditional PCB materials, such as FR4.
One of the main advantages of ARLON 85N is its improved thermal performance. The material has a higher glass transition temperature of TG=260 degrees Celsius almost double that of standard FR4 materials, which allows it to withstand higher operating temperatures. This is particularly important for applications that generate a lot of heat, such as power electronics, and can help to extend the life of electronic components and improve the overall performance of the PCB.
Another advantage of ARLON 85N is its improved mechanical strength. The material is highly durable and has a low coefficient of thermal expansion (CTE) at 16, which makes it less prone to warping or cracking at high temperatures. This can help to improve the reliability of the PCB, especially for applications that require a high level of mechanical stability, such as aerospace and military applications.
ARLON 85N also offers improved electrical performance. The material has a low dielectric constant and loss tangent, which helps to reduce electromagnetic interference (EMI) and improve signal integrity. This is particularly important for high-frequency and high-speed applications, such as telecommunications and networking.
In addition to these advantages, ARLON 85N also offers a number of cost benefits. The material is less expensive than other high-performance materials, such as ceramic or specialty ROGERS materials, which can help to reduce the overall cost of the PCB. Additionally, the improved thermal performance of ARLON 85N can help to reduce the cost of cooling systems, which can further reduce the overall cost of not only the bare PCB but more importantly efficiency of the final product.
ARLON 85N is widely used in applications such as power electronics, aerospace, aircraft, military, automotive, and industrial controls that require high thermal stability and reliable performance at high temperatures. It is also widely used in high-frequency and high-speed applications, such as telecommunications and networking, where its low dielectric constant and loss tangent can help to improve signal integrity.
Typical features and advantages of Arlon 85N are:
*Low in-plane (x,y) expansion of 6-9 ppm/°C allows attachment of SMT devices with minimal risk of solder joint failure due to CTE mismatch.
* Random fibre organic reinforcement guarantees outstanding dimensional stability and reduced misregistration for improved multilayer yields.
* Decomposition temperature of 407°C, compared with 300-360°C for typical high-performance epoxies, offering outstanding high-temperature lifetime performance.
* Up to 50% or more reduction in cure time compared with competitive products.
* Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
* Toughened, Non-MDA chemistry is more resistant to cracking during drilling
* Non-halogenated chemistry – Halogen Free Material, ideal for Radioactive applications.
* RoHS/WEEE compliant For more information on design and fabrication of your next high-performance PCB with ARLON 85N Material, please don’t hesitate to contact the team at sales@pcbglobal.com

A majority of the printed wiring board laminates bear the popular names of their constituent materials, such as Epoxy, Polyimide, PTFE, and the like, which are more often the generalization of the chemical names of the principal resin systems. Recently, products have been evolving suitable for high-performance applications. These new materials and their various combinations make the past generalizations more difficult to sustain. For instance, Epoxy and FR-4 are broad categories that accommodate characteristics such as Low Flow, Lead-Free, Multifunctional, CAF resistant, Green, and High-Speed Digital epoxy products. The slash sheets of the industry’s current laminate and prepreg specifications, IPC-4101, also reflects this proliferation.

Conventional adhesive based laminates are still popular in the flexible circuit industry, and they have demonstrated their performance in industries demanding high-reliability such as medical, military, automotive, and aerospace. Of late, adhesiveless laminates are finding their way into several applications as these laminates have superior properties. This is because the adhesive layer is often the weakest link in the set of materials, which fails in harsh environments such as in the presence of high temperatures and harsh chemicals.

Adhesive Based Laminates for Rigid-Flex Circuits

These usually come in commercial grade and military or defense-aerospace grade. The commercial grade is commonly known as FR-1, which is a sandwich of copper, adhesive, polyimide, adhesive, and copper, making it the least expensive and easily processed material with UL approval. However, the significant amount of FR adhesive lowers its reliability.

The Low-Flow type of adhesive, LF 1.5, used for the military grade, gives the laminate a better bond strength compared to that of the FR types. However, the significant amount of LF acrylic still does not improve the reliability, and this material is considered old school in military design.

Adhesiveless Laminates for Rigid-Flex Circuits

For improving the reliability, manufacturers use the AP 2.0 type of laminate, which has copper chemically or electrochemically deposited and bonded on both sides of a Polyimide base, thereby removing any requirement of adhesive. AP 2.0 types of laminates offer easy processing, repeatable manufacturability, and good stability.

For high-speed applications where a good control over impedance is important, manufacturers prefer the TK 4.0 laminates. These are formed as a sandwich of Teflon on both sides of a Polyimide base, with copper chemically or electrochemically deposited and bonded onto the outer side of the Teflon layers. The presence of Teflon requires special equipment for processing TK 4.0, and requires significant amounts of expertise. Working with TK 4.0 also presents significant dimensional stability challenges.

To achieve high reliability as well as high speeds, manufacturers prefer to use LCP 6.0 laminates as prepreg material. This laminate typically uses Liquid Crystalline Polymer (LCP) as the base, with copper deposited and bonded on both sides, either chemically or electrochemically. However, the material is difficult to process, requiring special tools and significant amounts of specialized knowledge.

Newer Laminates 

The rigid-flex circuit industry uses several other newer types of laminates as well. One of them is the adhesiveless polyimide blend JT, which behaves more like Low-Flow, but can tolerate higher operating temperatures.

Another is an adhesiveless laminate specifically for high temperatures. This is a modified polyimide blend without acrylic and behaves more like AP. Meant for high reliability applications, this material has the maximum operating temperature.

Conclusion

For more information on the various laminates used in rigid flex printed circuits boards, or to find out if a certain type of laminate is better suited to your product capabilities and needs, please don’t hesitate to contact the team at sale@pcbglobal.com