Layers | 12 Layers |
Material | High TG TU-768 |
Thickness | 1.6 mm Thickness |
Copper Finish | 1/1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | Impedance Control |
Technology | Blind Vias |
Technology | Buried Vias |
Layers | 10 Layers |
Material | High TG 180A |
Thickness | 1.6 mm Thickness |
Copper Finish | 1/1/1/1/1/1/1/1/1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | Blind Vias |
Technology | Micro Vias |
Layers | 6 Layers |
Material | High TG TU-768 |
Thickness | 2.4mm Thickness |
Copper Finish | 2/2/2/2/2/2oz Copper |
Surface Finish | Immersion Gold - ENIG |
Layers | 10 Layers |
Material | High TG IT180A + Panasonic Polyimide Flex |
Thickness | 1.6 mm Thickness |
Copper Finish | 1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | 6 layers of Flex PCB |
Technology | Epoxy Fillets |
Technology | 0.2mm Vias |
Layers | 2 Layer |
Material | Arlon 85N |
Thickness | 1.0mm Thickness |
Copper Finish | 1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | Edge Plating |
Technology | Laser Routing |
Technology | Controlled Impedance |