EPIG - Electroless Palladium, Immersion Gold surface finish is a highly advanced technology in the field of printed circuit board (PCB) manufacturing. It is widely used in the electronics industry because of its several advantages over other surface finishes.
High Reliability: EPIG surface finish provides excellent adhesion between the copper substrate and the surface finish. It creates a barrier between copper and other elements, preventing oxidation and corrosion. EPIG surface finish has better reliability than other finishes because it has a high resistance to corrosion, solderability, and wire bonding. It also provides excellent protection against chemical and mechanical stress.
Uniform Thickness: EPIG surface finish provides a uniform thickness on the PCB. It ensures that the surface is even and consistent, which is crucial for the success of electronic devices. The thickness of EPIG surface finish is typically between 0.08 μm and 0.15 μm, which is much thinner than other surface finishes. This thinness ensures that the PCB is lightweight and compact.
RoHS Compliant: EPIG surface finish is RoHS compliant, which means that it is environmentally friendly and does not contain any hazardous substances. RoHS stands for Restriction of Hazardous Substances, and it is a European Union directive that restricts the use of six hazardous materials in electronic and electrical equipment.
Ideal for non-magnetic applications such as GPS, and radioactive type applications, contains no Nickel so will not interfere with sensitive magnetic fields.
Low Surface Roughness: EPIG surface finish provides a low surface roughness, which is essential for high-frequency applications. A rough surface can cause signal distortion, which can negatively impact the performance of the device. EPIG surface finish provides a smooth and flat surface, which improves the performance of the device.
Solderability: EPIG surface finish provides excellent solderability, which means that the PCB can be easily soldered. It also has a high resistance to thermal stress, which prevents delamination of the PCB during soldering. EPIG surface finish ensures that the solder joints are strong and reliable.
Wire Bonding: EPIG surface finish provides excellent wire bonding. Wire bonding is a method of connecting the semiconductor chip to the substrate. EPIG is the preferred finish due to the superior hardness of Palladium, also provides a reliable and strong connection between the chip and the substrate, which is essential for the success of electronic devices.
In conclusion, EPIG surface finish is an excellent choice for printed circuit board manufacturing because of its high reliability, uniform thickness, RoHS compliance, cost-effectiveness, low surface roughness, solderability, and wire bonding. EPIG surface finish ensures that electronic devices are durable, reliable, and high performing.
For further information on EPIG surface finish for your next PCB project please don’t hesitate to contact the team at firstname.lastname@example.org