| Layers | 12 Layers |
| Material | High TG TU-768 |
| Thickness | 1.6 mm Thickness |
| Copper Finish | 1/1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1/1oz Copper |
| Surface Finish | Immersion Gold - ENIG |
| Technology | Impedance Control |
| Layers | 10 Layers |
| Material | High TG 180A |
| Thickness | 1.6 mm Thickness |
| Copper Finish | 1/1/1/1/1/1/1/1/1/1oz Copper |
| Surface Finish | Immersion Gold - ENIG |
| Technology | Blind Vias |
| Layers | 6 Layers |
| Material | High TG TU-768 |
| Thickness | 2.4mm Thickness |
| Copper Finish | 2/2/2/2/2/2oz Copper |
| Surface Finish | Immersion Gold - ENIG |
| Technology | . |
| Layers | 10 Layers |
| Material | High TG IT180A + Panasonic Polyimide Flex |
| Thickness | 1.6 mm Thickness |
| Copper Finish | 1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1oz Copper |
| Surface Finish | Immersion Gold - ENIG |
| Technology | 6 layers of Flex PCB |
| Layers | 2 Layers |
| Material | Arlon 85N |
| Thickness | 1.0mm Thickness |
| Copper Finish | 1/1oz Copper |
| Surface Finish | Immersion Gold - ENIG |
| Technology | Edge Plating |