| Layers | 12 Layers | 
| Material | High TG TU-768 | 
| Thickness | 1.6 mm Thickness | 
| Copper Finish | 1/1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1/1oz Copper | 
| Surface Finish | Immersion Gold - ENIG | 
| Technology | Impedance Control | 
| Technology | Blind Vias | 
| Technology | Buried Vias | 
        | Layers | 10 Layers | 
| Material | High TG 180A | 
| Thickness | 1.6 mm Thickness | 
| Copper Finish | 1/1/1/1/1/1/1/1/1/1oz Copper | 
| Surface Finish | Immersion Gold - ENIG | 
| Technology | Blind Vias | 
| Technology | Micro Vias | 
        | Layers | 6 Layers | 
| Material | High TG TU-768 | 
| Thickness | 2.4mm Thickness | 
| Copper Finish | 2/2/2/2/2/2oz Copper | 
| Surface Finish | Immersion Gold - ENIG | 
        | Layers | 10 Layers | 
| Material | High TG IT180A + Panasonic Polyimide Flex | 
| Thickness | 1.6 mm Thickness | 
| Copper Finish | 1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1oz Copper | 
| Surface Finish | Immersion Gold - ENIG | 
| Technology | 6 layers of Flex PCB | 
| Technology | Epoxy Fillets | 
| Technology | 0.2mm Vias | 
        | Layers | 2 Layer | 
| Material | Arlon 85N | 
| Thickness | 1.0mm Thickness | 
| Copper Finish | 1/1oz Copper | 
| Surface Finish | Immersion Gold - ENIG | 
| Technology | Edge Plating | 
| Technology | Laser Routing | 
| Technology | Controlled Impedance |