PCB Global Material

FR4 TG=170 / FR4 TG=180 / FR4 TU-862 / FR4 TU-768 / Rogers / Arlon 85N / Polyimide Flex / Nelco N4000 / Teflon / Taconic / Megatron 6 / FR408HR / Isola / Panasonic Polyimide/


  • Lead-free compatible FR-4 laminate
  • UV blocking/AOI compatible
  • High TG halogen-free product, TG 170°C (DSC)
  • Lower Z-axis CTE
  • Lower dissipation, DF<0.01

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SF302C Coverlay

  • High bonding strength, good dimensional stability, flammability UL94 V-0
  • Excellent soldering reliability, chemical resistance and electrical properties
  • Low adhesive flowing, good processability, suitable for both fast and traditional laminate styles
  • Compatible with EU RoHS directive, free of Pb, Hg Cd, Cr6+, PBB, PBDE, ect.

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  • Halogen free, flammability UL94 V-0
  • Excellent flexibility, thermal resistance, dimensional and electric properties
  • Compatible with EU RoHS directive, free from Pb, Hg, Cd, Cr6+, PBB, PBDE, ect.

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  • Lead-free compatible FR-4 laminate
  • High TG 170 °C (DSC)
  • Excellent thermal stability
  • Excellent anti-CAF performance
  • Low Z-axis CTE
  • Low water absorption

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ThinFlex A-3005RD Adhesiveless Laminate

ThinFlex A-3005RD is an adhesiveless double-sided (D/S) copper clad laminate, using UBE TPI film and laminated with RA copper foil on both sides. ThinFlex A-3005RD adhesiveless D/S composites are designed for a wide variety of flexible circuit applications which require advanced material performance, temperature resistance, fine pitch, and high reliability. 

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